In the exploration of developing advanced packaging, Intel has turned its attention to a new material for chip substrates: glass.

The rigidity of glass and its lower coefficient of thermal expansion make it superior to organic substrates, as the degree of expansion and warping is relatively small. According to Pooya Tadayon, Intel Academician and Director of Packaging and Testing Technology Development, these characteristics give glass a special advantage in process miniaturization, such as lower spacing.

"Using glass substrates allows us to introduce interesting features and geometric shapes to improve power transmission;" Tadayon said, "this material can also give birth to high-speed diodes that surpass 224G and even enter the 448G field."

With the development of tools and processes, as well as the rise of demand, the use of glass substrates will be a gradual process.